Components/Paste

Heat Sink Paste | 25 g | Injection

Brand: Nedis Article number: HSPA25I EAN number: 5412810306343

Heat Sink Paste | 25 g | Injection

Vendor Part Number: HSPA25I
EAN number: 5412810306343
Heat sink compound suitable for PCBs in transistors, for diodes, CPUs etc.
Use it between -50 °C and 180 °C
25 g compound injection type.
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General information

Color:White
Thermal Conductivity :>3.2Watt/m-k
Thermal Impedance:<0.06 degree C-in2/Watt
Operation Temperture:-50~180 C

Product specifications

Content 1 pc
Packaging Polybag
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